Keynote Speaker 1
Brief introduction:
Prof. Zhijun Zhang is an IEEE Fellow and Full Professor at the School of Automation Science and Engineering, South China University of Technology, where he has served since 2019 after working as an Associate Professor from 2015 to 2019. From 2013 to 2015, he worked as a Research Fellow at the Institute of Media Innovation, Nanyang Technological University. He received his Ph.D. degree from Sun Yat-sen University in 2012.
His main research interests include neural networks, robotics, human–robot/computer interaction, and numerical optimization. Prof. Zhang has published more than 80 scientific papers as author or co-author, including 52 SCI-indexed journal papers, 20 regular papers in IEEE Transactions as first or corresponding author, and 2 English book chapters. Among these publications, 39 papers were published in JCR Q1 journals. His work has appeared in leading journals and conferences such as IEEE Transactions on Automatic Control, IEEE Transactions on Neural Networks and Learning Systems, IEEE Transactions on Mechatronics, and IEEE Transactions on Cybernetics.
Prof. Zhijun Zhang
South China University of China, China
Speech Title: Multimodal Perception and Dynamic Neural Learning Methods for Embodied Intelligent Robots
Keynote Speaker 2
Prof. Zhiquan Liu
Southern University of Science and Technology, China
Speech Title: Tailoring the microstructure of electroplated copper for Cu-Cu direct bonding
Brief introduction:
Dr. Zhi-Quan Liu, Professor and Doctoral Supervisor in Southern University of Science and Technology, Talent of CAS, Guangdong Province and Shenzhen City. Has extensive experience in synthesis and characterization of interconnect materials, reliability engineering of advanced packaging, and development of packaging technology. Managed/participated in 20+ government-funded projects and 20+ joint R&D initiatives with top-tier industry partners. Authored 220+ peer-reviewed articles in top-tier journals such as Natureand Science, amassing over 6,500 citations.
Keynote Speaker 3
Brief introduction:
Prof. Yang Yue received the B.S. and M.S. degrees in electrical engineering and optics from Nankai University, China, in 2004 and 2007, respectively. He received the Ph.D. degree in electrical engineering from the University of Southern California, USA, in 2012. He is a Professor with the School of Information and Communications Engineering, Xi’an Jiaotong University, China. Dr. Yue’s current research interest is intelligent photonics, including optical communications, optical perception, and optical chip. He has published over 240 journal papers (including Science) and conference proceedings with >10,000 citations, five edited books, two book chapters, >60 issued or pending patents, >200 invited presentations (including 1 tutorial, >30 plenary and >50 keynote talks). Dr. Yue is a Fellow of SPIE, a Senior Member of IEEE and Optica. He is an Associate Editor for IEEE Access and Frontiers in Physics, Editor Board Member for four other scientific journals, Guest Editor for >10 journal special issues. He also served as Chair or Committee Member for >100 international conferences, Reviewer for >70 prestigious journals.
Prof. Yang Yue
Xi'an Jiaotong University, China
Speech Title: Machine Learning-Based Multiparameter Optical Performance Monitoring
Keynote Speaker 4
Assoc Prof. Siow Kim Shyong
Universiti Kebangsaan Malaysia (UKM) / National University of Malaysia, Malaysia
Speech Title: Sintering technology as die-bonding in micro-electronics packaging
Brief introduction:
Dr. Siow Kim Shyong is a Senior Research Fellow and Associate Professor at the Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia (UKM). His research focuses on surface science and engineering, particularly plasma surface modification, interfacial phenomena, surface characterization, and advanced bonding technologies for electronic, biomedical, and agricultural applications. His work integrates surface analytical techniques with materials design to understand and control physicochemical processes occurring at surfaces and interfaces.
He obtained his Ph.D. in Engineering from the Adelaide University and holds Bachelor’s and Master’s degrees in Materials Engineering from Nanyang Technological University, Singapore, as well as a Master of Laws (LL.M.) in Intellectual Property from the University of Turin–WIPO. He is also a certified Project Management Professional (PMP®) and a Level 3 MATRiZ Practitioner.
Dr. Siow has more than 23 years of experience spanning academia, research institutes, and the semiconductor industry, including positions at Infineon Technologies, ON Semiconductor, the National University of Singapore, and A*STAR. He has authored over 100 peer-reviewed journal publications, invited talk and contributed extensively to research on plasma-enabled surface engineering, surface characterization, and materials joining technologies.
Keynote Speaker 5
Brief introduction: Yanwei Dai received his B.E. degree in engineering mechanics from the Wuhan University of Technology, Wuhan, China, in 2011, M.E. degree in solid mechanics from China Agricultural University, Beijing, China, in 2013, and Ph.D. degree in mechanics from Tsinghua University, Beijing, China, in 2018. He has been with the Beijing University of Technology, Beijing, since 2018, where he was promoted through successive appointments as a postdoctoral research fellow, lecturer, and associate professor. In 2024, he was promoted exceptionally as a full professor. He has authored and coauthored more than 100 scientific publications including more than 70 peer-reviewed journal articles. Dr. Dai has been selected in National-level Young Talent (2024) and talent Lift Program of Young Scholars by Beijing Association for Science and Technology (2019).
Prof. Yanwei Dai
Beijing University of Technology, China
Speech Title: Thermomechanical Behaviors of Through-Silicon-Via Copper: From Calibration to Protrusion Control
Keynote Speaker 6
Prof. Jun Zhang
Chongqing University, China
Speech Title: Design of elastic metamaterials and realization through 3D printing techniques
Brief introduction:
Zhang Jun is a Professor and Doctoral Supervisor at the School of Aerospace Engineering, Chongqing University. His research primarily focuses on elastic wave manipulation in solids (metamaterials and metasurfaces), touch intelligent perception based on elastic waves, structural vibration isolation and attenuation, topology optimization, and computational solid mechanics. He has published over 40 papers in leading journals such as the International Journal of Mechanical Sciences (IJMS), Journal of Sound and Vibration (JSV), International Journal of Solids and Structures (IJSS), Journal of Applied Physics (JAP), Ultrasonics, and Chinese Journal of Theoretical and Applied Mechanics, accumulating nearly 1,000 citations. He has led more than eight research projects, including National Natural Science Foundation of China (NSFC). Dr. Zhang is a member of the Second Wave Mechanics Group of the Solid Mechanics Committee under the Chinese Society of Theoretical and Applied Mechanics (CSTAM) for the term 2025–2030. He also serves as a Youth Editorial Board Member for the 11th Editorial Board of Acta Mechanica Solida Sinica (2025–2030). He has long served as a peer reviewer for numerous journals, including JSV, IJMS, Journal of Zhejiang University, JASA, APL, Chinese Journal of Applied Mechanics, Chinese Journal of Theoretical and Applied Mechanics, Physics Letters A, MSSP, and Composites Part B.
Keynote Speaker 7
Brief introduction: Prof. Li Baokun is a senior researcher and professor at Anhui University of Science and Technology, with extensive experience in intelligent manufacturing, mechanical systems, and advanced materials processing. He has led several national and provincial research projects focusing on energy equipment reliability and intelligent monitoring systems. His interdisciplinary work bridges mechanical design and industrial digitalization, and he actively contributes to the development of high-performance manufacturing technologies in the Anhui region. His keynote lecture will present latest breakthroughs in sustainable manufacturing.
Prof. Baokun Li
Anhui University of Science and Technology, China
Speech Title: Analysis, Avoidance, and Applications of Mechanism Singularities
Keynote Speaker 8
Associate Researcher Fupeng Huo
Nanjing University of Aeronautics and Astronautics, China
Speech Title: Sintering Technology for SiC Power Semiconductors
Brief introduction:
Fupeng Huo, Ph.D. and Postdoctoral Fellow, Osaka University, Japan. Currently serves as Associate Professor, College of Integrated Circuits, Nanjing University of Aeronautics and Astronautics (NUAA). Dr. Huo has long been engaged in systematic scientific research in the field of wide bandgap (WBG) power semiconductor packaging interconnection and thermal management.
In the past five years, he has presided over 3 scientific research projects, including 1 talent project under the “Overseas Talent Introduction Program of the Ministry of Education (MOE)”, 1 enterprise horizontal project, and 1 project under the Japan Young Scientists Joint Research Program. He has also participated as a core member in 2 scientific research projects, including 1 national key project of Japan (responsible for a budget of 40 million Japanese Yen) and 1 Key Research and Development Program of Henan Province (International Cooperation).
In terms of academic outputs, he has published more than 30 papers in total, including 11 SCI-indexed papers and 4 EI-indexed papers as the first author in top journals in the field such as IEEE Transactions on Power Electronics and Journal of Materials Science & Technology. He has been granted 3 national invention patents.
His awards include: Best Student Paper Award, the 26th International Conference on Electronic Packaging Technology (ICEPT); Outstanding Technical Paper Award, ICEP 2025; First Prize of Science and Technology Award of Nonferrous Metals Industry; First Prize of Scientific and Technological Achievements Award of Henan Provincial Department of Education.
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